Field Service Engineer

Forming Our Future together

FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.

Rooted in our core values — Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People — we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.

Job Description:

Hiring a Field Service Engineer (FSE) for the wafer testing (Wafer Sort) requires a specific blend of electromechanical expertise and high-level communication skills. Since the semiconductor industry is global, English capability is the bridge between local operations and global headquarters.

Here is a comprehensive list of "hire items" or selection criteria for FFI probe FSE.

1. Technical Core Competencies

The candidate must be comfortable working with high-precision machinery in a cleanroom environment.

Equipment Experience: Hands-on experience with Automatic Test Equipment (ATE) (e.g., Teradyne, Advantest) and Wafer Probers (e.g., TEL, Accretech/TSK) is preferred.
System Knowledge: Understanding of the interface between the tester, the prober, and the Probe Card is preferred.
Troubleshooting: Ability to diagnose issues at the component level, including electronics (PCBs), pneumatics, and precision motors/robotics is preferred.
Calibration & PM: Proficiency in performing Preventive Maintenance (PM) and complex signal calibrations to ensure test accuracy. High power and micro-scope high frequency using is basic request

2. English Proficiency (Communication & Reporting)

Oral Communication (Conversation)

Technical Explanation: Can explain a complex "bridge failure" or "alignment error" to a non-technical manager or a foreign expert via a call?
Customer Handling: Ability to manage high-pressure situations while con call discussions.
Global Collaboration: Comfortable participating in technical hand-over meetings with support teams.

Written Documentation (Reporting)

Field Service Reports (FSR): Ability to write concise summaries of work performed, parts replaced, and pending actions.
Root Cause Analysis and 8D report: Proficiency in documenting "Why" a failure occurred using structured English (e.g., 8D reports or 5-Why analysis).
Email: internal and external email communications.

3. Professional Experience & Education

Education: Degree in Electrical, Electronic, Mechanical, or Mechatronics Engineering will be better, at least Bachelor or Master.
Semiconductor Context: Previous experience in a Wafer Sort or Final Test environment is highly preferred.
Data Analysis: Familiarity with yield management software or basic data logs to identify patterns in equipment failure.

4. Soft Skills & Work Logistics

Problem-Solving: A logical approach to "Step-by-Step" isolation of faults.
Flexibility: Willingness to work in shifts or be "on call," as wafer fabs operate 24/7.
Resilience: The ability to remain calm when a mass products are down with customer pressure
Probe card hand carry: around 15-20kg PC hand carry for troubleshooting needs
Traveling and relocation: agree to follow company arrangements when have business traveling and relocation needs

Skills:

Field Service Engineering, Probe Cards, Repair Services

Education & Experience:

Bachelor’s degree and a minimum of 2 years of related experience; or an advanced degree without experience; or equivalent work experience | Required