IC Packaging Engineer, Materials and Packaging Characterization

As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness. Minimum Qualifications Minimum requirement of a bachelors degree Preferred Qualifications BS in Materials Science, Mechanical Engineering, Physics, or a related technical field, with 3+ years of relevant industry experience strongly preferred Experimental Mechanics: Proven track record in experimental mechanics, material characterization, and the hands-on setup of test equipment. Analytical Tools: Hands-on experience with advanced material and failure analysis techniques (e.g., SEM, EDX, FIB, CSAM). Computational Skills: Proficiency with numerical simulation software, alongside strong programming capabilities in MATLAB and/or Scientific Python. Familiarity with Gen-AI, Machine Learning, and statistical data analysis is highly desirable. Leadership & Communication: Ability to drive independent R&D initiatives, paired with excellent communication skills to confidently present complex data, ideas, and strategic plans to cross-functional teams. Domain Expertise: Understanding of electronic packaging architectures, assembly processes, and package qualification requirements, coupled with a strong grasp of the mechanical behavior and reliability physics of packaging materials.