Integration and Metrology Engineer (50736)

TITLE: INTEGRATION AND METROLOGY ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: SR. MANAGER, PLATING MANUFACTURING ENGINEERING

SUMMARY:

Under the direction of the Sr. Manager, Plating Manufacturing Engineer, the Integration and Metrology Engineer is responsible for monitoring, sustaining, and providing support for the manufacturing process. Including detecting and correcting process errors, releasing and integrating new programs into the manufacturing line, providing guidance and support to engineers regarding experiments or evaluations, and providing feedback to the back-end process group. The engineer is responsible for creating recipes, developing and implementing methodologies for improving wafer quality on the prototype wafers with a specific focus on detecting and characterizing wafer level visual defects using Focused Ion Beam (FIB) and Automatic Inspection Tool (AIT) tool. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

• Engages in process improvement activities based on Wafer Design Change Notifications (WDCN) and Wafer Process Change Notifications (WPCN), including following up with CCN documentation for line conversion activity
• Examines newly transferred products to ensure leading wafer follows wafer configuration specifications
• Creating and optimizing recipes for both FIB and automatic inspection tools
• Interacts and responds to inquiries from other engineering groups regarding new metrology requests, wafer quality, or yield issues
• Improves wafer level defect and yield by conducting comprehensive failure analysis using FIB, AIT, and microscope and provides detailed analysis
• Drives failure analysis, present findings, and recommends improvement plan
• Analyzes data using JMP, MS Visual Basic, or similar software application to determine the root cause of process variations; develops charts or reports and presents findings
• Evaluates sample wafers, conducts experiments, and reviews results in support of yield improvement activities; issues Lot Configuration Changes (LCC) and CCN’s as needed
• Interprets analytical defect data from imaging equipment such as FIB, SEM, EDX, and TEM
• Monitors and supports manufacturing process controls to alert for abnormal wafers; recommends corrective action if needed
• Responds to inquiries from other team members, managers, or departments
• Uses Statistical Process Control (SPC) and other complex software applications to analyze large volumes of data; develops charts or reports and presents findings before groups or teams
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*