NPI Engineer - Die Saw

Handles product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots at die fab processes (die bank, wafer mount, wafer grind, wafer saw, AOI).

• Provide process support for die bank, wafer mount, wafer grinding, wafer saw and automated inspection for NPI projects and safe launches working closely with the technical leader.
• Generate qualification plan for NPI projects from die bank to automated inspection (as appliable) based on risk analysis defining the critical input variable and output responses referencing the characterization spec.
• Generate qualification reports based on qualification plan per deliverables defined for the project.
• Create wafer saw and AOI/Camtech recipes as necessary in collaboration with sustaining PE.
• Lead the investigation on issues related to die fab processes for NPI projects in collaboration with the technical leader to identify rootcause and generate improvement plans.
• Handles documentation related to the process/es of assignment.
• Handles other responsibility as deemed necessary by the supervisor.
• Qualify low-cost materials and tools.

• Engineering graduate or Material Science or Physics Graduate or Equivalent.
• Experience in semiconductor assembly manufacturing for at least 3 years with specific experience on wafer saw process.
• Skilled in data analysis using Minitab and other software that will aid process performance assessment.
• Knowledgeable on 8D, FMEA, Control Plan, DOE & Risk Management and Mitigation.
• Team player and result-driven.
• Critical thinker.
• Good presentation skills.