Principal Product Engineer – High Power Module

Lead product engineering activities for Advanced Power Modules in the New Product Development (NPD) division. This role focuses on developing next-generation power modules using advanced embedded packaging technologies, such as chip embedding and interposer-based integration, to achieve high performance and reliability. You will ensure manufacturability, quality, and robustness through prototype builds, qualification runs, and validation processes, collaborating with global cross-functional teams to deliver automotive-grade solutions.

• Prototype & Qualification Builds
  • Plan and execute prototype and qualification runs for embedded power modules, ensuring compliance with NPD phase-gate requirements.
  • Validate build integrity and maintain accurate documentation of process parameters and outcomes.
• Advanced Embedded Packaging
  • Apply expertise in chip embedding, interposer integration, and thermal/electrical optimization for module development.
  • Perform process characterization and data analysis to optimize yield, reliability, and performance.
• Failure Analysis & Issue Resolution
  • Conduct root-cause analysis for product issues and collaborate with design, process, and reliability teams to implement corrective actions.
  • Document lessons learned and integrate improvements into future builds.
• Cross-Functional Collaboration
  • Work closely with design, technology development, and manufacturing teams to ensure smooth transition from development to production.
  • Communicate status, risks, and mitigation plans proactively to global stakeholders.
• Compliance & Release
  • Confirm qualification evidence meets internal standards before product release.
  • Support audits and maintain traceability of product engineering deliverables.

• Bachelor’s degree in engineering (advanced degree preferred).
• 10+ years in semiconductor product engineering with strong experience in power module development.
• Proven expertise in power semiconductor technologies.
• Familiarity with advanced embedded packaging technologies (e.g., chip embedding, interposer-based integration).
• Strong skills in SPC, DOE, and data-driven problem solving.
• Excellent communication and collaboration skills for global team environments.
• Highly organized, self-motivated, and passionate about continuous improvement.