Technical Program Manager - Sensing

In this highly visible role, the successful candidate will be the resident factory expert in manufacturing process, yields and overall factory readiness for mass production. In this technical lead role, your ability to combine knowledge of module and component manufacturing, process integration, problem solving, failure analysis, and process controls to deliver results is a must. The TPM will work in conjunction with the New Production Introduction group as well as a multi-functional team of Design, Supplier Quality, Test, Service and Engineering to ensure that top quality products and services from the factories and drive excellence across the full product life cycle. Minimum Qualifications Bachelor's degree in Engineering or related field 12+ years of experience providing technical support of high-volume consumer electronics Proven technical skills, including experience and thorough understanding of wafer level, component, PCBA, module assembly, test, pack-out processes, and process integration Hands-on in the factory processes, with frequent time spent on the factory floor Highly motivated and able to drive issues to closure In-depth knowledge in quality methodologies with common tools, including process capability statistical analysis Skilled in DOE, FMEA, SPC, failure analysis, data analysis, and justification of specifications Understand tolerance stack ups for assemblies and part level Excellent problem solver, using structured problem-solving methodology to assign root cause, plus develop and implement corrective and preventative actions Excellent interpersonal skill required, and the ability to concisely understand and communicate issues, and lead the team to a solution Works on significant and unique issues where analysis of situation or data requires an evaluation of intangibles Experience analyzing complex or ambiguous situations and exercising independent judgment to drive results Creates formal networks involving coordination among groups Strong communicator who can translate high-level goals into tangible action plans Expert level de-bugging skills. Must have proven ability to tackle problems under tight time constraints Experience presenting technical findings, recommendations, and corrective action plans to executive leadership Ability to travel internationally 25%-35%. Preferred Qualifications Masters in Engineering or related field. PhD is a plus. Working knowledge of injection molding, stamping, plating, micro-machining, thin film coatings, lens assembly, lamination processes Experience in sensing modules, ARVR modules, and product design is a plus Experience with JMP, Tableau, or Six Sigma methodologies Excellent project/program management skills (planning, cost, delivery, risk analysis). Experience working in a complex organization