Technology Development Manager / Senior Manager

onsemi is seeking a highly motivated Technology Development Manager or Senior Manager to lead the development, qualification, and high-volume manufacturing ramp of Embedded Power Module technologies at our East Fishkill, NY 300mm wafer fab.

This role is a critical leadership position within the Technology Development organization, with end-to-end accountability for developing onsemi’s advanced Embedded Power Module process and packaging concepts into qualified, manufacturable, and competitive products aligned with onsemi’s long-term technology and business roadmaps.

The successful candidate will lead a team of experienced development engineers and will serve as a key technical and organizational interface across Business Units, Product Engineering, Manufacturing, Operations, Packaging, Reliability, Finance, external partners, and executive leadership.

People & Organization Leadership

• Manage and develop a team of approximately 5–15 engineers.

• Build a high-performance engineering culture and support talent development and succession planning.

Technical & Technology Ownership

• Serve as overall technical leader for Embedded Power Module technology development, qualification, and ramp.

• Own technical readiness across process integration, yield, reliability, and manufacturability.

Program Execution & Delivery

• Lead and deliver multiple concurrent technology development programs aligned with global corporate technology development and manufacturing requirements.

• Partner with program and product management to transition technologies into high-volume production.

Cross-Functional & Executive Engagement

• Act as primary interface with internal stakeholders and external partners.

• Communicate technical and program status to senior and executive leadership.

QUALIFICATIONS

• M.S. degree or higher in engineering (PhD preferred).

• Extensive semiconductor industry experience (typically 15+ years).

• Strong leadership, communication, and cross-functional collaboration skills.

Preferred

• Deep knowledge of power modules, ICs, advanced packaging, and backend processing.

• Experience with Cu plate-up, RDL via etch, encapsulation, pick-and-place, sinter attach, and HV testing is desired.

Salary: onsemi is excited to share the base salary range for this position is $147.000 to $250,000 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf