Associate AI / Simulation Engineer, Thermal/CFD
- Develop and execute Computational Fluid Dynamic (CFD) and thermal simulations for electronics cooling applications, including airflow, forced and natural convection, and conjugate heat transfer
- Support component-, board-, enclosure-, and sub-system–level thermal analysis for electronic products
- Assist in rapid model setup and simulation turnaround to support internal service requests and customer engineering needs
- Apply appropriate boundary conditions, material properties, and solver settings under guidance from senior engineers
- Support steady-state and transient thermal analyses, including power ramp-up, duty cycles, and basic fault scenarios
- Post-process and interpret simulation results to identify thermal risks, airflow issues, and design improvement opportunities
- Assist in correlating simulation results with experimental data, lab measurements, or field observations
- Prepare clear technical summaries and documentation of assumptions, methods, results, and limitations
- Support verification and validation (V&V) activities by following defined modeling and review processes
- Engage with senior engineers to understand UL safety considerations, certification objectives, and modeling expectations
- Learn and apply best practices in mesh strategy, numerical stability, convergence assessment, and result credibility
- Collaborate effectively with cross-functional teams and contribute to a learning-oriented, supportive team culture
- Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, or a related field from a reputed institution
- 2–5 years of industrial or applied experience in Computational Fluid Dynamic (CFD) and thermal-fluid simulations (internships and thesis work may be considered)
- Strong fundamentals in: Fluid mechanics and basic turbulence modeling, Heat transfer (conduction, convection, radiation), Thermodynamics relevant to electronics cooling,
- Hands-on exposure to CFD model setup, solution execution, and result interpretation
- Familiarity with at least one commercial simulation tool such as: ANSYS Icepak, ANSYS Fluent, FLOTHERM, FLOEFD, STAR-CCM+, COMSOL, or similar software
- Basic understanding of: Mesh generation and grid quality concepts, Solver settings and convergence behavior, Ability to follow structured modeling workflows and technical guidelines
- Good written and verbal communication skills, with ability to explain results clearly
- Self-motivated, detail-oriented, and comfortable learning in a technically rigorous environment
- Exposure to electronics thermal management, including ICs, PCBs, heat sinks, fans, vents, and enclosures
- Awareness of electronics packaging constraints (space, airflow resistance, materials, power dissipation)
- Basic experience with thermal testing, such as thermocouple placement, temperature measurement, or data acquisition
- Introductory experience correlating simulation results with test or experimental data
- Familiarity with transient thermal behavior and power cycling effects
- Interest in automation, scripting, or AI-assisted simulation workflows
UL INTERNATIONAL-SINGAPORE PRIVATE LIMITED
Bosch Group
vinci4d