IC Package Integration Lead

• Work with cross-functional teams and lead package integration and architecture efforts. • Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs. • Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development. • People managerial skills highly desirable. • Travel – 5-10% Minimum Qualifications BS and 10+ years of relevant industry experience. Preferred Qualifications We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired. Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA. Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints. Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable. Excellent problem solving with strong physics and fundamentals. Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers. Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost. Ability to work independently and take on projects with minimum supervision. Ability to lead and manage teams.