Packaging Assembly Engineer

Responsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel. Minimum Qualifications 5+ years of extensive experience in Semiconductor Packaging field. Working knowledge in materials characterization and analysis. Working knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology. General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc. Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers. Ability to work independently and take on projects with minimum supervision. Good engineering problem solving skills with strong engineering physics and fundamentals. Can use package design softwares, APD, Virtuoso, etc. Working knowledge in memory packaging. Good program management skill. M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field desired. Preferred Qualifications None