Substrate Technologist

- Lead RFSIP package substrate development, pathfinding technology, and roadmap definition. - Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM. - Work across a variety of cross-functional groups directly and involve themselves in engineering and product development. - Drive industry with sophisticated package solutions, new material development, and specs. - 5% International travel. Minimum Qualifications BS and 10+ years of relevant industry experience. Preferred Qualifications MS or Ph.D. and 5+ years of relevant industry experience. Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap. Hands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist, etc. Familiar with package assembly and integration process preferred. Experience in Cadence Allegro platform tools and design review for manufacturing (DFM). Exceptional technology development & project management skills. Strong communication & collaborative skills.